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 HD74HC283
4-bit Binary Full Adder
Description
The sun ( ) outputs are provided for each bit and the resultant carry (C4) is obtained from the fourth bit. This adder features full internal look ahead across all four bits. This provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation. The adder logic, including the carry, is implemented in its true for meaning that the endaround carry can be accomplished without the need for logic or level inversion.
Features
* * * * * High Speed Operation: tpd = 19 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C)
HD74HC283
Function Table
Outputs Inputs A1/A3 L H L H L H L H L H L H L H L H B1/B3 L L H H L L H H L L H H L L H H A2/A4 L L L L H H H H L L L L H H H H B2/B4 L L L L L L L L H H H H H H H H When C0 = L/When C2 = L 1/3 L H H L L H H L L H H L L H H L 2/4 L L L H H H H L H H H L L L L H C2/C4 L L L L L L L H L L L H H H H H When C0 = H/When C2 = H 1/3 H L L H H L L H H L L H H L L H 1/4 L H H H H L L L H L L L L H H H C2/C4 L L L L L H H H L H H H H H H H
H : high level L : low level Note: Input conditions at A 1, B1, A2, B2, and C0 are used to determine outputs 1 and 2 and the value of the internal carry C2. The values at C 2, A3, B3, A4 and B4 are then used to determine outputs 3, 4 and C4.
2
HD74HC283
Pin Arrangement
2 B2 A2 1 A1 B1 C0 GND
1 2 3 4 5 6 7 8 B2 A2 1 A1 B1 C0 C4 2 B3 A3 3 A4 B4 4
16 VCC 15 B3 14 A3 13 3 12 A4 11 B4 10 4 9 C4
(Top view)
3
HD74HC283
Block Diagram
C4
B4 A4
4
B3 A3
3
B2 A2
2
B1 A1
C0
1
4
HD74HC283
DC Characteristics
Ta = 25C Item Input voltage Symbol VIH Ta = -40 to +85C Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40 A A I OL = 4 mA I OL = 5.2 mA Vin = VCC or GND Vin = VCC or GND, Iout = 0 A V I OH = -4 mA I OH = -5.2 mA Vin = VIH or VIL I OL = 20 A V Vin = VIH or VIL I OH = -20 A V Unit V Test Conditions
VCC (V) Min Typ Max Min 2.0 4.5 6.0 1.5 -- 3.15 -- 4.2 -- -- -- -- -- -- -- -- -- -- 0.5 1.5 3.15 4.2 --
VIL
2.0 4.5 6.0
1.35 -- 1.8 -- 1.9 4.4 5.9 4.13 5.63 -- -- --
Output voltage
VOH
2.0 4.5 6.0 4.5 6.0
1.9 2.0 -- 4.4 4.5 -- 5.9 6.0 -- 4.18 -- 5.68 -- -- -- -- -- -- -- -- -- --
VOL
2.0 4.5 6.0 4.5 6.0
0.0 0.1 0.0 0.1 0.0 0.1 -- -- -- --
0.26 -- 0.26 -- 0.1 -- 4.0 --
Input current Quiescent supply current
Iin I CC
6.0 6.0
5
HD74HC283
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Symbol Ta = -40 to +85C Max 190 38 33 190 38 33 190 38 33 190 38 33 95 19 16 10 pF ns ns A1 or B1 to C4 ns C0 to C4 ns A1 or B1 to 1 Unit ns Test Conditions C0 to 1
VCC (V) Min Typ Max Min 2.0 4.5 6.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 19 -- -- 19 -- -- 19 -- -- 19 -- -- 5 -- 5 150 -- 30 26 -- --
Propagation delay t PLH time t PHL
t PLH t PHL
2.0 4.5 6.0
150 -- 30 26 -- --
t PLH t PHL
2.0 4.5 6.0
150 -- 30 26 -- --
t PLH t PHL
2.0 4.5 6.0
150 -- 30 26 75 15 13 10 -- -- -- -- -- --
Output rise/fall time
t TLH t THL
2.0 4.5 6.0
Input capacitance
Cin
--
6
19.20 20.00 Max 16 9 7.40 Max 6.30
Unit: mm
1 1.3
1.11 Max
8
0.51 Min
2.54 Min 5.06 Max
7.62
2.54 0.25
0.48 0.10
0.25 - 0.05 0 - 15
Hitachi Code JEDEC EIAJ Weight (reference value)
+ 0.13
DP-16 Conforms Conforms 1.07 g
Unit: mm
10.06 10.5 Max 16 9
5.5
1
*0.22 0.05 0.20 0.04
8 0.80 Max
2.20 Max
0.20 7.80 + 0.30 -
1.15 0 - 8 0.70 0.20
1.27 *0.42 0.08 0.40 0.06
0.12 M
Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DA -- Conforms 0.24 g
*Dimension including the plating thickness Base material dimension
0.10 0.10
0.15
Unit: mm
9.9 10.3 Max 16 9 3.95 1 1.27 0.635 Max 8
0.11 0.14 + 0.04 - 1.75 Max
*0.22 0.03 0.20 0.03
0.10 6.10 + 0.30 -
1.08 0 - 8
0.67 0.60 + 0.20 -
*0.42 0.08 0.40 0.06
0.15 0.25 M
*Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
FP-16DN Conforms Conforms 0.15 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.


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